Update, not good news
I took apart and inspected the existing joints as suggested, they looked fine I couldnt see any damage though I don’t have my microscope right now.
So I ordered some USB-C connectors off Amazon these ones specifically, the plan being to use wires to bridge the pads.
https://www.amazon.com/gp/aw/d/B091CRLJM2
I tested them with a multimeter and in both orientations the data and power pads remain correctly connected. They’ve got traces on the PCB setup to make sure nothing gets flipped.
I also tested the wiring of the Micro USB port, it’s as follows left to right, from above looking down.
GND , D+ , D- , ID , VCC
From what I understand the ID pin is used for mobile to mobile type connections where you can change which device is the host, but it shouldn’t matter in this case (I wasn’t able to test).
Wiring to the USB-C was easy, I found that the wires within a V5 cable are actually pretty good and took solder easy.
Now the bad stuff, taking the Micro USB off. The supporting legs took about 20 seconds of heat and a solder wick pad before they came free. The pins, however, because of their proximity to some SMCs made it much more difficult to apply heat but I thought I got them cleared out.
But unfortunately, underneath the port, is a large support pad that it is soldered to, and I didn’t know about. So when I attempted to take the port off, it didnt budge. Instead of reevaluating I cave man’d it and forced it off, and it did come off. But also took every single pad off with it 
Yeah, not good. I tried scrapping the mask off the traces, and for GND and VCC that did work. The traces go to FB1 and FB2 respectively. But there just wasn’t enough for the D+ and D- pins.
So I’ve got a new one ordered from VEX, and a magnetic cable from Amazon. If someone had the proper setup and tools they’d be able to get it done, but because VEX doesn’t like electronics modding there’s no reason to do it for comp teams. Hopefully they just release a USB-C one themselves.